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Winbond - TOP 5 Memory IC Supplier in Global Market

Low Power with High Performance
Mobile SDR SDRAM, DDR SDRAM, DDR2 SDRAM and DDR3 SDRAM

Thinner, Lighter & Less Power Consumption

Mobile DRAM
Product CategoryDensitiesVoltageData Width
LPSDR SDRAMbuy16Mb~256Mb1.8V/1.8Vx16, x32
LPDDR SDRAMbuy128Mb~1Gb1.8V/1.8Vx16, x32
LPDDR2 SDRAMbuy256Mb~2Gb1.8V/1.2Vx16, x32
LPDDR3 SDRAMbuy2Gb~4Gb1.8V/1.2Vx16, x32

Winbond Mobile DRAM

Nowadays, devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and down-sizing.
Winbond developed the mobile DRAM devices with a low IDD current value which support both x16 and x32 data widths. Major features include Sequential or Interleave burst, High Clock rate, Standard Self Refresh, Partial-Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh Rate(ATCSR), Deep Power-Down (DPD), and Programmable output buffer driver strength. They are ideal not only for mobile phone and tablet market but also for mobile consumer electronics and mobile communication such as portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.

TechDesign
Official Online Store

Why TechDesign is better than distributors?

100% shipped directly from Winbond.
Worldwide flat rate shipping.
No more hassle from distributors.
No worry for bogus parts.
Price advantage.
For more memory ICs, please visit Winbond official online store - TechDesign.