Nowadays, devices are evolving towards the trend of thinner, lighter and less power consumption. In order to remain high performance, the memories used in these devices are required to have features such as high-speed, low-power consumption and down-sizing.
Winbond developed the mobile DRAM devices with a low IDD current value which support both x16 and x32 data widths. Major features include Sequential or Interleave burst, High Clock rate, Standard Self Refresh, Partial-Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh Rate(ATCSR), Deep Power-Down (DPD), and Programmable output buffer driver strength. They are ideal not only for mobile phone and tablet market but also for mobile consumer electronics and mobile communication such as portable multimedia players, wearable devices, automotive applications, consumer electronics, gaming devices, and mobile devices.