HYPERRAM

Winbond's HYPERRAM™ is a groundbreaking memory technology designed to offer a compact, energy-efficient, and easily integrated alternative to traditional pseudo-SRAM (pSRAM) in applications like IoT and consumer devices, automotive systems, and industrial equipment. With the latest additions in 2021, the HYPERRAM™ product line features devices manufactured using Winbond's advanced 25nm process, resulting in densities up to 256Mb and 512Mb. These devices come in various package types, including 24BGA, WLCSP, and KGD. Key advantages of HYPERRAM™ technology include: 1. Ultra-low power consumption: HYPERRAM™ devices achieve exceptionally low standby power consumption of just 35μW Additionally, they exhibit operating power consumption that is less than half that of competing pSRAM products. 2. Design simplicity: HYPERRAM™ devices use just 13 signal pins, compared to 31 signal pins in pSRAM. This makes the board layout much simpler to design and manufacture. 3. Space-saving: The low pin-count packages and reduced number of connections to the host controller combine to minimize the memory system's overall board footprint. In summary, Winbond's HYPERRAM™ technology offers an innovative, low-power, and space-saving solution for memory requirements in various applications.