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HYPERRAM™

(Showing results for “hyperram”)

Winbond's HYPERRAM™ is a groundbreaking memory technology designed to offer a compact, energy-efficient, and easily integrated alternative to traditional pseudo-SRAM (pSRAM) in applications like IoT and consumer devices, automotive systems, and industrial equipment. With the latest additions in 2021, the HYPERRAM™ product line features devices manufactured using Winbond's advanced 25nm process, resulting in densities up to 256Mb and 512Mb. These devices come in various package types, including 24BGA, WLCSP, and KGD. ...

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Density
64Mb
Voltage
1.7 ~ 1.95V
Frequency
200MHz
Package
TFBGA - 24
Dimension
6X8mm2
Temperature
-40~85˚C
Interface Type
HYPERRAM™
I/O
8BIT
Totals: 1

ComparePart NumberDescription
Unit Price
Availability Datasheet DensityVoltageFrequencyPackageDimensionTemperatureInterface TypeI/OECCDTRPage SizeConcurrent OperationDefault Read Mode
W956D8MBYA5I
64Mb HYPERRAM™ 200MHz TFBGA24
Winbond
1:USD 0.96000
100:USD 0.90000
1,000:USD 0.84000
20,001+:Quote by quantity
Out of stock
64Mb 1.7 ~ 1.95V 200MHz TFBGA - 24 6X8mm2 -40~85˚C HYPERRAM™ 8BIT
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