Winbond is a specialty memory IC integrated device manufacturer engaged in product design, research and development, and wafer fabrication to the marketing of brand name products.
With a 12-inch fab, Winbond offers a whole series of Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory products that target a top-tier clientele and quality-oriented applications. Winbond's advantage of technological autonomy and prudent capacity strategy enables it to build a highly flexible production system and create synergy among product lines, which allows it to meet customers' diverse needs.
Winbond implements rigorous process control and quality control, strengthening yield analysis and supply chain management to satisfy customer needs. The long-standing efforts in quality assurance have earned Winbond a good reputation and resulted in the accreditation of ISO 9001, TS 16949, QC 080000, ISO 14001, and OHSAS 18001.
Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995 with headquarters in Central Taiwan Science Park, Taichung, Taiwan.