QspiNAND Flash

Winbond, a leading semiconductor company, has developed a unique product category, QspiNAND Flash, specifically designed to simplify the tasks of embedded designers working on NOR flash systems with densities beyond 512Mb. These QspiNAND products offer an efficient and cost-effective solution by providing 1Gb and 2Gb density options with the same SPI interface, delivering a seamless transition from NOR to NAND Flash memory. These QspiNAND family of products have built-in ECC (Error Correcting Code) that detects and corrects errors and offers contiguous good memory (bad block management), which offloads these functions from the controller and supports Executive-in-Place (XiP) functionality, in which an SoC or processor executes application code directly from the external flash memory without shadowing it to DRAM. In conclusion, by offering cost-effective and versatile solutions, these products enable efficient code execution, streamlined memory management, and advanced features like continuous read and Executive-in-Place (XiP) support.Winbond's QspiNAND Flash products provide a range of benefits for embedded designers working on high-density NOR flash systems. View less