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winbond w25n04kvzeie

W25N04KVZEIE

4Gb QspiNAND Flash 104MHz SON8

Supplier:

Winbond

Certification:

certcert
Specification
Attribute Value
Density
4Gb
Frequency
104MHz
Temperature
-40~+85˚C
Dimension
8X6mm2
Voltage
2.7 ~ 3.6V
ECC
ECC
DTR
DTR
Package
SON - 8
Description

Introduction

Winbond's W25N04KV is part of the QspiNAND Flash series designed to offer an efficient and cost-effective storage solution for applications that exceed the density limitations inherently associated with NOR Flash, specifically at densities beyond 512Mb. This particular product facilitates greater code storage capacity without sacrificing the convenience of the SPI interface, making it suitable for various applications in the industrial sector.

 

Function & Applications

The W25N04KV serves as non-volatile memory storage, providing robust error management through its built-in ECC (Error Correcting Code). This feature ensures data integrity by detecting and correcting errors, an essential factor in applications where reliability is critical. Furthermore, the on-chip ECC offloads error management from the system controller, simplifying system design.

Applications for the W25N04KV include a range of industrial use cases where high-density code storage is required. This memory can support Executive-in-Place (XiP) functionality, benefiting applications where high-speed code execution directly from Flash is necessary, eliminating code shadowing delays.

Performance Parameters

The W25N04KV operates within a voltage range of 2.7V to 3.6V and can perform at a speed of up to 104MHz, serving various performance demands. The part comes with a uniform 2KB+128B page size, offering a consistent architecture for memory management. Performance timings include a 60µs page read time with ECC enabled, a 250µs typical page program time, and a block erase time of just 2ms (typical). It also supports an OTP (One Time Programmable) memory area for secure storage needs.

Package Types, Interface & Pin Configuration

The W25N04KV QspiNAND Flash by Winbond is accessible in two package types: the WSON8 with dimensions of 6x8mm and the TFBGA24, also with a 6x8mm form factor. Both packages are designed to interface with systems via a Quad SPI (Serial Peripheral Interface), utilizing the x1/x2/x4 I/O modes for flexible connection scalability. The exact pin configuration can be referenced from detailed datasheets provided by Winbond for precise system design and integration.

Reliability & Lifespan

Winbond's W25N04KV is engineered for durable and reliable performance, with a temperature range accommodating the stresses of industrial operations spanning from -40℃ to 85℃ and an extended range up to 105℃ for more demanding environments. The inclusion of ECC and bad block management underscores the commitment to longevity and consistent operation throughout the product's life.

Standards & Certifications

As an industrial-grade product, the W25N04KV adheres to relevant international standards and certifications to ensure quality and reliability. Though specific certifications are not listed, products like these are typically compliant with JEDEC standards and may have certifications like RoHS and REACH for environmental compliance.

Application Cases & Reference Designs

The W25N04KV finds its strength in industrial scenarios requiring large code storage capacities, such as advanced IoT devices, embedded computing systems, and network equipment. Reference designs for using the W25N04KV in such applications can often be obtained from Winbond, aiding developers in integrating the memory into their designs efficiently.

Packaging *

In Stock: 4,176

MOQ: 1 / MPQ: 1

Total USD 6.88
QuantityUnit Price
1USD 6.88000
100USD 6.47000
1,000USD 5.99000
20,001 +Quote by quantity
Technical Documentation