W25N02JWZEIF

The W25N02JW is a high-performance QspiNAND Flash product designed by Winbond. It is engineered using the company's proprietary 46nm fabrication process, and is based on a single-level cell (SLC) architecture, providing higher reliability compared to multi-level cell (MLC) and triple-level cell (TLC) solutions.

This QspiNAND Flash IC is designed for optimal performance, offering a data transfer rate four times faster than parallel NAND and other competing QspiNAND flash technologies. With transfer speeds of up to 83MB/s and support for dual-quad I/O interfaces (with a maximum data transfer rate of 166 MB/s), the W25N02JW greatly accelerates boot-up times in applications such as instrument clusters.

The W25N02JW is ideal for automotive display applications, including Advanced Driver Assistance Systems (ADAS), Instrument Cluster Applications, Center Information Display (CID), Vehicle-To-Everything (V2X) communication, and Fast Booting systems.

Key performance parameters of the W25N02JW include:
- Density: 2Gb
- Vcc: 1.7V - 1.95V
- Frequency: STR166MHz / DTR80MHz
- Temperature Range: -40°C ~ 85°C / -40°C ~ 105°C
- Page Read Time with ECC Enable: 50us
- Page Program Time: 250us (typical)
- Block Erase Time: 2ms (typical)

The W25N02JW also features a hardware reset pin, OTP memory area support, and is available in two package types: WSON8 6x8 and TFBGA24 6x8. Its industrial status is currently in mass production.

As a professional semiconductor expert, Winbond's W25N02JW is designed to meet rigorous standards and certifications, ensuring high reliability and longevity for its application cases and reference designs in the automotive and other industries. The flexibility and high performance of this QspiNAND Flash IC make it an ideal choice for demanding applications that require exceptional data transfer speeds and reliability.