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HYPERRAM™
Winbond Electronics launched HYPERRAM™product in 2015, and join the HYPERRAM™ camp. In terms of HYPERRAM™, Winbond has launched 32Mb/64Mb/128Mb density products already. In 2021, HYPERRAM™ products produced on Winbond’s 25nm process extends densities up to 256Mb and 512Mb.
* Winbond also provide HYPERRAM™ for 512Mb/ 128Mb/ 32Mb density series. This is limited for specific clients and applications. If you are seeking for HYPERRAM™ for 512Mb/ 128Mb/ 32Mb memory, please submit RFQ or contact us directly.
What is HYPERRAM™ ?
HYPERRAM™ is a new technical solution which supports the HyperBus interface. The first generation of it offers a throughput up to 333 MB/s, and HYPERRAM™ 2.0 made it possible to boost up to 400 MB/s.
HyperBus is a low signal count, Double Data Rate (DDR) interface, that achieves high speed read and write throughput. The DDR protocol transfers two data bytes per clock cycle on the DQ input/output signals. HyperBus technology was first unveiled by Cypress in 2014, and according to Cypress, “the HyperBus interface draws upon the legacy features of both parallel and serial interface memories, while enhancing system performance, ease of design, and system cost reduction.
Winbond’s HYPERRAM™ provides design simplicity, space saving, and low power operation while delivering the performance needed in these applications. The lower signal count reduces routing area, and HYPERRAM™ is offered in small form factor packages, further reducing the design footprint.
As previously mentioned, HYPERRAM™ memory is suitable for applications that require low power consumption and high MCU computing power. Dashboards in automotive market, HMI industrial control panels in industrial 4.0 market, voice control devices in smart home market, or smart bands in wearables market are all examples that request the above characteristics.
Overall, HYPERRAM™ is easily controlled with low pin-counts (13 signal pins) and low power consumption. It also works in the same bandwidth comparing to other DRAMs or pSRAMs. By having the feature of self-refresh, the system memory is easier to use, and the development of firmware and drivers is simplified as well.
HYPERRAM™ memory is suitable for applications that require low power consumption and high MCU computing power. Dashboards in automotive market, HMI industrial control panels in industrial 4.0 market, voice control devices in smart home market, or smart bands in wearables market are all examples that request the above characteristics.
What is the benefits of HYPERRAM™ ?
The Main features are Low pin count, low power consumption, and easy control.
Low Power:
By Hybrid Sleep Mode (HSM), Winbond’s HYPERRAM™ gives standby power consumption as low as 35μW. The operating power less than half that of equivalent pSRAM products.
For example, the power consumption in standby mode of Winbond's 64Mb HYPERRAM™ is only 90uW@1.8V and 110uW@3V, while the same capacity SDRAM consumes about 2000uW@3.3V. Furthermore, the power consumption of HYPERRAM™ in Hybrid Sleep Mode is only 45uW@1.8V and 55uW@3V, which is a significant difference from the Standby mode of SDRAM.
Compare with pSRAM and Low Power SDR SDRAM in operation mode and standby mode, HYPERRAM™ has great power saving performance.
(As an example in 64Mb HYPERRAM™ product.)
In Operation Mode:
HYPERRAM™ 1.8v : 60mW
HYPERRAM™ 3.3v : 120mW
pSRAM : 110mW
LPSDR : 90mW
SDR SDRAM : 220mW
In Standby Mode:
HYPERRAM™ 1.8v : 95uW
HYPERRAM™ 3.3v : 105uW
LPSDR : 150uW
pSRAM : 390uW
SDR SDRAM : 600uW
Base on these two list of power consumption, we can find HYPERRAM™ has strong benefit for power saving in mobile and IoT applications.
Less Signal Pins:
HYPERRAM™ has only 13 signal pins, which can greatly simplify the PCB layout design. It also means that during design phase of the products, more PIN-outs will be available for other use cases with HYPERRAM™ regarding those designed with DRAMs. And because of connecting fewer pins, it is more cost-effective as well. Simplifying control interface is another feature of HYPERRAM™. Based on pSRAM architecture, HYPERRAM™ can automatically return to Standby mode after read/ write operation. This could reduce the effort of system design and firmware development. It also makes the board layout much simpler for design and manufacturing.
Smaller form factor:
Winbond support the small form factor to save more space. Low pin-count packages and a lower number of connections to the host controller reduce the space of system’s board footprint and save space in any devices with tiny type, like wearable.
Comparison for form factor:
Winbond HYPERRAM™ : 4mm*4mm
PSRAM : 8mm*6mm
JEDEC SDRAM : 8mm*8mm
What applications are suitable for HYPERRAM™?
HYPERRAM™ is especially for applications that require low power consumption and high MCU computing power in automotive, industrial 4.0, smart home and wearable markets, such as dashboards, HMI industrial control panels, smart home devices, voice control devices, bike computer and smart bands, etc.. Besides, for IoT edge device applications, various design considerations such as low cost, low power consumption, and computing efficiency also suit the characteristic of HYPERRAM™.
Other than above, for battery-powered devices such as smart speakers and smart meters, battery life has become the key to the success of the product, in addition to the rich IoT function and easy-to-use human interface. This makes low power consumption increasingly important. To achieve long battery life, in addition to using power consumption MCU, the other low-power peripheral components should also be considered, and HYPERRAM™ is designed for this and it’s the best solution for IoT application.
With high throughput and small form factor size, HYPERRAM™ could be applied to various markets, like Automotive, Wearable, Industrial, IoT, and Smart home.