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HYPERRAM™

(Showing results for “W959D8NFY”)

Winbond's HYPERRAM™ is a groundbreaking memory technology designed to offer a compact, energy-efficient, and easily integrated alternative to traditional pseudo-SRAM (pSRAM) in applications like IoT and consumer devices, automotive systems, and industrial equipment. With the latest additions in 2021, the HYPERRAM™ product line features devices manufactured using Winbond's advanced 25nm process, resulting in densities up to 256Mb and 512Mb. These devices come in various package types, including 24BGA, WLCSP, and KGD. ...

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Density
512Mb
Voltage
1.7 ~ 1.95V
Frequency
200, 250MHz
Package
TFBGA - 24
Dimension
6X8mm2
Temperature
-40~85˚C
Interface Type
HYPERRAM™
I/O
8BIT
Totals: 1

ComparePart NumberDescription
Unit Price
Availability Datasheet DensityVoltageFrequencyPackageDimensionTemperatureInterface TypeI/OECCDTRPage SizeConcurrent OperationDefault Read Mode
W959D8NFYA5I
512Mb HYPERRAM™ 200, 250 MHz TFBGA24
Winbond
1:USD 4.12000
100:USD 3.87000
1,000:USD 3.58000
20,001+:Quote by quantity
In Stock: 6
512Mb 1.7 ~ 1.95V 200, 250MHz TFBGA - 24 6X8mm2 -40~85˚C HYPERRAM™ 8BIT
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