M2351SFSIAAP

The M2351SFSIAAP microcontroller series is powered by Arm® Cortex®-M23 core with TrustZone® for Armv8-M architecture, having multi-chip-package (MCP) with M2351 Series and Winbond’s W77F Secure Flash. With the use of Winbond’s Secure Flash solution, M2351SFSIAAP can well protect code and data of a microcontroller from reducing vulnerability exposures.

In addition to the enhanced security of microcontroller storage, the M2351SFSIAAP remains to keep all the security features with the M2351 Series, covering Arm®v8-M TrustZone®, Execute Only Memory (XOM), Cryptographic Hardware Accelerators, Secure Debug, system-level tamper detection pins, and all software tools for application development are same with M2351 Series. The package dimension is also the same with M2351 Series in LQFP-64.

Key Features:

•Security Core
-Arm® Cortex®-M23 core delivering 0.95 DMIPS per MHz
-TrustZone® for ARM®v8-M
-32-bit Single-cycle hardware multiplier and 32-bit 17-cycle hardware divider
-Up to 8 regions MPU_NS (for non-secure world)
-Up to 8 regions MPU_S (for secure world)
-8 Security Attribution Unit (SAU) memory regions

•Memories
-Up to 512 KB of dual bank flash memory. Dual bank Flash memory allows read-while-write programming
-Up to 96 KB SRAM, first 32KB SRAM with hardware parity check
-4 KB Flash for user program loader (LDROM)
-2 KB OTP for general-purpose control use, (2 KB data + 1 KB lock bit) easy for PLM (Product Lifecycle Management)implementation

-32 KB Secure Boot ROM

-ISP/ICP/IAP programming
 
-External Bus Interface (EBI) supports maximum external address space of 1 M Bytes, up to 3 chip selects and 8/16-bit external data bus
 
•Secure Flash stacked
-4 MByte Flash memory density 
-Secure Binding and communication between MCU and Secure Flash
 

•Power management
 
-Normal run: 97 μA/MHz (LDO);
 
-                  45 μA/MHz (DC-DC)
 
-Idle: 36 μA/MHz (CPU clock disabled, LDO);
-        17μA/MHz (CPU clock disabled, DC-DC)

-Power-down: 20 μA
-Standby power-down: 3.0 μA 
-Deep Power-down: 4.0 μA (with VBAT) 
-Deep Power-down: 1.5 μA (without VBAT)
-VBAT supply for RTC:  2.5 μA (80 bytes spare registers
 
•Crypto and Security
 
-True random number generator (TRNG)
-AES 256/ SHA 384/ 3-DES/ DES
-The ECC accelerator is a fully compliant implementation for the prime field GF(p) and binary field GF(2m) algorithms. The prime field GF(p) supports up to NIST P-521. The binary field GF(2m) supports up to NIST B-571 and NIST K-163, K-233, K-283, K-409, and K-571.
-CRC calculation unit
 
  
•Communication interfaces 
-Up to 11 UART interfaces (up to 10.66 MHz), with up to 3 ISO-7816-3 interfaces, 6 RS-485, 6 IrDA and 2 LIN interfaces
-Up to 5 I²C interfaces (up to 1 Mbps), with up to 3 I²C with SM Bus/ PM Bus
-Up to 7 SPI interfaces (up to 64 MHz), with 4 I²S interfaces, additional 1 Quad-SPI interface
-Up to 5 I²S interfaces, 4 I²S shared with 4 SPI
-Secure Digital I/O (SDIO)(up to 50 MHz)
 
 
 
•Advanced connectivity
-USB 2.0 full speed OTG controller with on-chip PHY
-One CAN interface up to 1 Mbps (CAN 2.0A and 2.0B standard)
-Support crystal-less USB
 
 
 
•Operating Characteristics
-Running up to 64 MHz
-Voltage range: 1.8V to 3.6 V
-Temperature range: -40°C to 105°C
-Selectable core power voltage levels: 1.26V, 1.2V in run and idle mode
 
 
 
•Packages (RoHS)
-LQFP 64-pin