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winbond w25q64jvssim

W25Q64JVSSIM

64Mb Serial NOR Flash 133MHz SOP8

Supplier:

Winbond

Certification:

certcert
Specification
Attribute Value
Density
64Mb
Frequency
133MHz
Temperature
-40~+85˚C
Dimension
208mil
Voltage
2.7 ~ 3.6V
Package
SOP - 8
Description

The W25Q64JV is a 64M-bit Serial NOR Flash memory device developed by Winbond, providing a storage solution for systems with limited space, pins, and power requirements. This high-performance device is ideal for applications such as code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP), and storing voice, text, and data. It operates on a 2.7V to 3.6V power supply with low current consumption and is available in various space-saving packages.

 


Function & Applications

The W25Q64JV is designed for a wide range of applications, including automotive, industrial, and consumer electronics. It offers flexibility and performance superior to ordinary Serial Flash devices, with a flexible architecture featuring uniform 4KB sectors. This allows greater adaptability in applications that demand data and parameter storage. Moreover, its support for standard SPI, Dual/Quad I/O SPI, and JEDEC standard ID features makes it compatible with a variety of systems.

Performance Parameters

The W25Q64JV supports SPI clock frequencies of up to 133MHz, allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using Fast Read Dual/Quad I/O. These transfer rates outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. Additionally, the device boasts a minimum of 100K Program-Erase cycles per sector and more than 20-year data retention, ensuring reliable high-performance operation.

Package Types, Interface & Pin Configuration

The W25Q64JV is available in various package types, including 8-pin SOIC 208-mil, 8-pad WSON 6x5-mm/8x6-mm, 16-pin SOIC 300-mil, 8-pad XSON 4x4-mm, 24-ball TFBGA 8x6-mm (6x4 ball array), 24-ball TFBGA 8x6-mm (6x4/5x5 ball array), and 12-ball WLCSP. The device supports a range of interfaces, such as standard SPI, Dual SPI, Quad SPI, and QPI, to cater to different application requirements.

Reliability & Lifespan

With a wide operating temperature range of -40°C to +85°C, or -40°C to +105°C (depending on the variant), the W25Q64JV is suitable for harsh environments. Its low power consumption (<1µA power-down) ensures energy-efficiency, while advanced security features such as software and hardware write-protect, OTP protection, and unique 64-bit device ID ensure data integrity and protection.

Standards & Certifications

The W25Q64JV adheres to JEDEC standards for manufacturer and device ID, offering guaranteed quality and compatibility. Furthermore, the automotive-grade variants of the device are AEC-Q100 compliant, ensuring robust construction and reliability for automotive applications.

Application Cases & Reference Designs

Winbond's W25Q64JV has been successfully implemented in a variety of applications, including digital displays in automotive dashboards, ADAS (Advanced Driver Assist Systems), comfort, entertainment, and navigation systems in the center console. Its small packages and high-density capabilities cater to the needs of space-constrained systems and advanced applications. These application cases and reference designs showcase the versatility and reliability of the W25Q64JV in real-world scenarios.

Features

Product Feature 1

4 I/O Fixed
UID & OTP Feature
Volatile & Non-Volatile SR
Programmable Output Driver Strength
Individual Block/Sector Write Protection

Packaging *

In Stock: 73,313

MOQ: 1 / MPQ: 1

Total USD 0.73
QuantityUnit Price
1USD 0.73000
100USD 0.68000
1,000USD 0.63000
20,001 +Quote by quantity
Technical Documentation