64Mb HYPERRAM™ 200MHz TFBGA24
HYPERRAM TM has more throughout and smaller form factor size than PSRAM does
Product Feature 1
Winbond's HYPERRAM™ product, W956D8MBY, is an ultra-low power consumption, and compact memory solution designed for applications in IoT and consumer devices, automotive, and industrial equipment. Developed using Winbond's advanced 25nm process technology, it provides efficient and reliable data storage with an ultra-low power consumption profile.
Function & Applications
The W956D8MBY HYPERRAM™ features an innovative HyperBus interface, which allows for faster data throughput and a smaller form factor compared to traditional pseudo-SRAMs. With a maximum clock rate of 200MHz and double-data rate (DDR) support up to 400 MT/s, this memory solution is ideal for high-performance applications requiring efficient data storage and retrieval. Its wide operating temperature range (-40°C to 85°C) makes it suitable for automotive and industrial usage, as well as consumer electronics such as smartwatches and IoT devices.
W956D8MBY HYPERRAM™ boasts configurable output drive strength and low power consumption due to its Hybrid Sleep Mode and Deep Power Down features. It also offers configurable burst characteristics, including linear and wrapped burst lengths, allowing for flexible data management. Array refresh modes include Full Array Refresh and Partial Array Refresh, providing options for optimizing memory refresh based on application needs.
Package Types, Interface & Pin Configuration
The W956D8MBY HYPERRAM™ is available in a 24-ball TFBGA package, supporting a simplified board layout with only 13 signal pins, compared to the 31 signal pins required for pseudo-SRAM solutions. The compact package configuration saves space and simplifies the design and manufacturing process.
Reliability & Lifespan
Winbond's 25nm process technology ensures high reliability and longevity of the W956D8MBY HYPERRAM™. Its wide operating temperature range, robust power management features, and efficient data handling capabilities make it a reliable memory solution suitable for various applications and environments.
Standards & Certifications
As a leading semiconductor manufacturer, Winbond adheres to strict quality management standards and certifications to ensure the highest performance and reliability of its products, including the W956D8MBY HYPERRAM™.
Application Cases & Reference Designs
The W956D8MBY HYPERRAM™ has been successfully implemented in numerous application cases across multiple industries, including IoT devices, consumer electronics, automotive systems, and industrial equipment. The high-density, low-power memory solution offers significant benefits in terms of design simplicity, space-saving, and ultra-low power consumption, making it a popular choice for device manufacturers aiming to optimize the performance and efficiency of their products.