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winbond w25q128jwbiq

W25Q128JWBIQ

128Mb Serial NOR Flash 133MHz TFBGA24

Supplier:

Winbond

Certification:

certcert
Specification
Attribute Value
Density
128Mb
Frequency
133MHz
Temperature
-40~+85˚C
Dimension
6X8mm2
Voltage
1.7 ~ 1.95V
Package
TFBGA - 24
Description

Introduction

The W25Q128JW is a 128M-bit Serial Flash memory produced by Winbond, designed to provide a storage solution for systems with limited space, pins, and power requirements. As part of the 25Q series, it offers flexibility and performance beyond that of ordinary Serial Flash devices, making it ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP), and storing voice, text, and data. The W25Q128JW operates on a single power supply with low current consumption, and the devices come in space-saving packages.

Function & Applications

This memory device is organized into 65,536 programmable pages of 256 bytes each, enabling up to 256 bytes to be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase), or the entire chip (chip erase). The W25Q128JW has 4,096 erasable sectors and 256 erasable blocks, allowing flexibility in applications that require data and parameter storage.

Performance Parameters

The W25Q128JW supports the standard Serial Peripheral Interface (SPI) along with a high-performance Dual/Quad output, as well as Dual/Quad I/O SPI. It can handle SPI clock frequencies of up to 133MHz, allowing equivalent clock rates of 532MHz (133MHz x 4) for Quad I/O when using the SPI Fast Read Quad I/O instructions. These transfer rates outperform standard Asynchronous 8 and 16-bit Parallel Flash memories while consuming less power.

Package Types, Interface & Pin Configuration

The W25Q128JW comes in various space-efficient package options, including 8-pin SOIC 208-mil, 8-pad WSON 6x5-mm / 8x6-mm, 16-pin SOIC 300-mil, 24-ball TFBGA 8x6-mm, and 21-ball WLCSP. The device supports SPI with Single, Dual, Quad I/O, Automotive and Industrial grade packages, with options available for different temperature ranges.

Reliability & Lifespan

The W25Q128JW is designed for high performance and durability, offering a minimum of 100K program-erase cycles and over 20 years of data retention. Its low power consumption ranges from 1mA active current to less than 1µA in power-down mode, and it's operational temperature range extends from -40℃ to +105℃.

Standards & Certifications

Winbond's W25Q128JW supports optional Change Control (PPAP) to ensure consistency in design and manufacturing processes.

Application Cases & Reference Designs

The W25Q128JW is commonly used in automotive applications, such as digital displays in dashboards, comfort and entertainment systems, and navigation consoles. Its small package sizes and high density make it an ideal choice for space-constrained systems, while its high transfer rate and low power consumption facilitate real-time 2D/3D image rendering and instant-on capabilities.

Features

Product Feature 1

4 I/O Fixed
UID & OTP Feature
Volatile & Non-Volatile SR
1mA Active Read Current, <1µA Power Down Current
Erase/Program Suspend & Resume and Discoverable Parameters (SFDP) Register

Packaging *

Out of stock

MOQ: 1 / MPQ: 1

QuantityUnit Price
1USD 1.52000
100USD 1.43000
1,000USD 1.33000
20,001 +Quote by quantity
Technical Documentation