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winbond w25q16jwsniq

W25Q16JWSNIQ

16Mb Serial NOR Flash 133MHz SOP8

Supplier:

Winbond

Certification:

certcert
Specification
Attribute Value
Density
16Mb
Frequency
133MHz
Temperature
-40~+85˚C
Dimension
150mil
Voltage
1.65 ~ 1.95V
Package
SOP - 8
Description

Introduction

The W25Q16JW is part of the new family of SpiFlash memories by Winbond. As a 16Mbit (2Mbyte) Serial Flash memory solution, it fundamentally targets systems with restrictions in space, pins and power requirements. Being part of the 25Q series, the W25Q16JW offers flexibility and superior performance than ordinary Serial Flash devices, making it ideal for code shadowing to RAM, running code directly from XIP and for storing voice, text and data.

Function & Applications

This device is uniquely crafted for applications that require data and parameter storage, operating on a power supply of 1.65V to 1.95V. The device array is arranged into 8192 programmable pages of 256-bytes, with up to 256 bytes capable of programming at a time. Its high compatibility with the standard Serial Peripheral Interface and support for Dual/Quad I/O SPI make it optimal for high-performance applications.

The W25Q16JW also finds valuable uses in automotive applications, where digital displays in car dashboards need reliable flash memories for real-time 2D/3D image rendering. Furthermore, they apply to comfort, entertainment, navigation, and other systems which require small packages for space-constrained systems and high density for advanced applications.

Performance Parameters

The W25Q16JW operates at high performance with SPI clock frequencies up to 133MHz equivalent to 532MHz (133MHz x 4) when using the SPI Fast Read Quad I/O instructions. This permits greater transfer rates beyond the standard Asynchronous 8 and 16-bit Parallel Flash memories. The device boasts of a continuous data transfer rate of 66MB/s and supports a minimal of 100k Program-Erase cycles.

Package Types, Interface & Pin Configuration

The W25Q16JW is presented in different package types including 8-pin SOIC 150/208-mil, 8-pad USON 4x3-mm, 8-pad WSON 6x5-mm, 8-ball WLCSP, and 8-pad XSON 2x3-mm. The device works with a Serial Peripheral Interface alongside Dual/Quad I/O SPI, providing support to Serial Clock, Chip Select, and Serial Data I/O0 (DI), I/O1 (DO), I/O2, and I/O3.

Reliability & Lifespan

Winbond guarantees more than 20-year data retention and a power-down current consumption as low as 0.1µA. It operates within wider temperature ranges of -40℃ to +85℃ and -40℃ to +105℃, thus ensuring resilience and prolonged lifespan even under harsh conditions.

Standards & Certifications

The W25Q16JW adheres to the JEDEC standard manufacturer and device identification and SFDP Register.

 

Application Cases & Reference Designs

As part of a large suite of SpiFlash memories, W25Q16JW is applied in a range of automotive technologies for instant-on and real-time 2D/3D image rendering. Solutions include comfort, entertainment, and navigation systems.

Features

Product Feature 1

4 I/O Fixed
UID & OTP Feature
Volatile & Non-Volatile SR
1mA Active Read Current, <1µA Power Down Current
Programmable Output Driver Strength

Packaging *

In Stock: 25,507

MOQ: 1 / MPQ: 1

Total USD 0.45
QuantityUnit Price
1USD 0.45000
100USD 0.42000
1,000USD 0.39000
20,001 +Quote by quantity
Technical Documentation